What is a wafer? What is its manufacturing process?

1. Silicon refining and purification: First, silicon is extracted from silicon ore. Then,wafer tester the silicon is purified by chemical treatment and physical methods to remove impurities and other unwanted elements.

2. Monocrystalline silicon growth: The high-purity silicon is heated and melted, and the melted silicon is gradually solidified into monocrystalline silicon under specific conditions using methods such as the Czochralski process or the Floating Zone method.

3. Wafer molding: single crystal silicon is cut into thin sheets to form round wafers. During this process, the edges of the wafer are usually removed because the edge portion cannot be used to make a complete chip.

4. Surface Cleaning: Chemical etching and surface cleaning are performed on the wafer to remove protective layers and other impurities from the surface.

5. Initial Oxidation: Thermal oxidation is used to generate a SiO2 buffer layer, which is used to reduce the subsequent stress on the wafer from the Si3N4.

6. Thermal CVD: Thermal Chemical Vapor Deposition (CVD) is used to form a thin film on the wafer.wafer probe testing This method offers high productivity and good ladder layup.

7. Thermal treatment: Before applying photoresist, the surface of the washed substrate is treated to increase the adhesion between the photoresist and the substrate, preventing the pattern from falling off during development and side corrosion during wet etching.

8. Wafer backside grinding: after the production of integrated circuits on the front side of the wafer,vibration isolation table in order to reduce the thermal resistance of the device, improve heat dissipation and ease of packaging, the need to thin the back side of the wafer. This process is realized by means of a lapping machine.

9. Silicon Nitride Removal: Silicon Nitride is removed using dry oxidation.

10. Ion Injection: Boron ions (B+3) are injected into the substrate through the SiO2 film by ion fabrication to form a P-trap. Ion implantation allows for precise control of low concentration impurity distribution, which is difficult to achieve with diffusion.

wafer tester purification Silicon Nitride

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